In stock

WYLIE Explosion Proof Solder Pad for Safe Soldering

$1.95

The WYLIE Explosion Proof Solder Pad is designed for BGA chip reballing and soldering work, with a heat-resistant surface that helps keep the stencil flat during heating.
Its anti-blowout design helps reduce solder popping and supports more consistent solder ball formation during chip repair.
Features:
- Designed for BGA chip reballing and soldering applications.
- Anti-blowout design helps reduce solder popping during heating.
- Heat-resistant construction helps prevent warping during high-temperature use.
- Provides a flat working surface to support consistent reballing results.
- Suitable for chip repair involving phone motherboards, graphics cards, and laptop chips.
Specifications:
- Brand: WYLIE
- Product Type: BGA Soldering Pad
- Application: Chip Reballing and Soldering
- Key Feature: Anti-Blowout Design
- Material: Heat-Resistant Material