- iPhone 16
- iPhone 16 Plus
- iPhone 16 Pro
- iPhone 16 Pro Max
- The QianLi Bumblebee QS689 stencil is designed for motherboard chip reballing and solder paste application on the iPhone 16 series.
- It features dedicated chip-pattern openings for supported components across the iPhone 16, 16 Plus, 16 Pro, and 16 Pro Max models.
- Features:
- Designed for motherboard IC reballing and solder paste application.
- Multiple chip-pattern openings for different motherboard components.
- Model-specific layout for the iPhone 16 series.
- Helps align solder paste or solder balls with the corresponding IC pad pattern.
- Flat stencil design for precision board-level repair work.
- Specifications:
- Brand: QianLi
- Series: Bumblebee
- Model: QS689
- Product Type: Motherboard IC Reballing Stencil
- Compatible Models: iPhone 16, iPhone 16 Plus, iPhone 16 Pro, iPhone 16 Pro Max
- Application: IC Reballing and Solder Paste Application
- Please check the warranty policy for details!
- Same Day Ground and Overnight Shipping.


