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MIJING High Precision BGA Reballing Stencil for iPhone 17 Series
- SKU
- MIJ-IPH23
- New Bin Number
- 4-Z0-6K
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$1.95
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- iPhone 17 Series
- The MIJING High Precision BGA Reballing Stencil is designed for reballing work on chips used in the iPhone 17 series.
- Its multiple precision-patterned openings support solder ball placement across different chip layouts for board-level repair tasks.
- Features:
- Designed for BGA reballing tasks involving iPhone 17 series chips.
- Multiple patterned openings accommodate different chip layouts.
- Precision hole patterns help position solder balls during chip reballing.
- Suitable for motherboard-level repair and chip refurbishment work.
- Specifications:
- Brand: MIJING
- Product Type: BGA Reballing Stencil
- Compatible Series: iPhone 17 Series
- Stencil Type: Multi-pattern BGA stencil
- Please check the warranty policy for details!
- Same Day Ground and Overnight Shipping.
