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MECHANIC UFO BGA Reballing Stencil for iPhone 6 to 17 Pro Max
- SKU
- 6942174890497
- New Bin Number
- 4-Y1-3H
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$19.99
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- iPhone 6 to 17 Pro Max
- The MECHANIC UFO BGA Reballing Stencil is designed to assist with BGA chip reballing during iPhone motherboard repair.
- Its high-temperature-resistant steel construction supports precise solder ball placement across compatible chip layouts for iPhone 6 through iPhone 17 Pro Max.
- Features:
- Designed for BGA chip reballing during iPhone motherboard repairs.
- Multiple stencil patterns for different chip layouts.
- High-temperature-resistant construction for rework applications.
- Designed to resist deformation and bulging at elevated temperatures.
- Round stencil design with a hanging hole for storage.
- Specifications:
- Brand: MECHANIC
- Series: UFO
- Product Type: BGA Reballing Stencil
- Material: Steel
- Design: Round stencil with multiple chip patterns
- Temperature Resistance: Up to 500°C
- Please check the warranty policy for details!
- Same Day Ground and Overnight Shipping.
