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Amtech NC-559-V2 Sn63/Pb37 T4 90% 40g jar (183)

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Amtech NC-559-V2 Sn63/Pb37 T4 90% 40g jar (183)

SKU: AMTECH-183
New Bin Number: 4-W6-3G

$19.00

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Amtech NC-559-V2 Sn63/Pb37 T4 90% 40g jar (183)

Amtech NC-559-V2 Sn63/Pb37 T4 90% 40g jar (183)

Amtech NC-559-V2 Sn63/Pb37 T4 90% 40g jar (183)

Amtech NC-559-V2 Sn63/Pb37 T4 90% 40g jar (183)

Suitable for PCB, motherboard, BGA, SMD, IC, and other electronic soldering and rework applications requiring Sn63/Pb37 solder paste.

Sn63/Pb37 leaded solder paste with a melting point of approximately 183°C.
T4 fine-particle formulation provides precise application for small pads and components.
90% metal content provides consistent solder deposition and reliable solder joints.
NC-559-V2 no-clean flux system offers excellent wetting and leaves clear, low residue after soldering.
40g jar is suitable for professional PCB, motherboard, BGA, SMD, and microsoldering repair applications.

Please check the warranty policy for details!
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