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Amtech NC-559-V2 Sn63/Pb37 T4 87% Met Solder Paste (35g) Syringe
- SKU
- AMTECH-TBD
- New Bin Number
- 4-Z7-2C
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$18.15
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- NC-559-V2-TF Tacky Flux Paste
- Is a high-performance, no-clean solder paste with a REL0 flux classification, designed for fast, precise electronic assembly. It delivers exceptional print definition at speeds up to 100 mm/sec, with a long stencil life and wide process window for maximum production flexibility. NC-559-V2 ensures low voiding, clear residue, and excellent wetting on most board finishes and is available in both print and dispense grades to suit various manufacturing needs.
- Amtech NC-559-V2 Sn63/Pb37 T4, 87% Met, no-clean solder paste is supplied in a 35g syringe for smooth and controlled dispensing during BGA/SMD rework and PCB assembly. Melting temperature: 183°C (361°F).
- Specs: Not LF (Not Lead-Free), Sn63/Pb37 Tin & leaded alloy • T4 powder 25–45µm particle size • 87% metal content • No-clean flux • 35g syringe • Part No: TBD
- Recommended for BGA and SMD rework, Micro Soldering & re-balling stencil applications, touch-up soldering, PCB assembly, and repair tasks that require accurate Tin paste placement.
- Benefits
- Enables precise, consistent solder deposition for high-density PCB designs
- Supports automated manufacturing with excellent printability and reflow characteristics
- Enhances joint reliability for leaded applications
- Reduces defects like bridging, voiding, and tombstoning
- Compatible with various application methods including stencil printing and dispensing
- No-clean formulations reduce the need for post-soldering cleaning, saving time and cost
- No Corrosion
- Complies with REACH articles 33 and 67 of regulation (EC) No. 1907/2006
- Please check the warranty policy for details!
- Same Day Ground and Overnight Shipping.
