- Suitable for PCB, motherboard, BGA, SMD, IC, and other heat-sensitive electronic soldering and rework applications requiring low-temperature Sn42/Bi58 solder paste.
- Sn42/Bi58 lead-free solder paste with a low melting point of approximately 138°C.
- Low-temperature formulation helps reduce thermal stress on heat-sensitive components and circuit boards.
- T4 fine-particle formulation provides precise application for small pads and detailed electronic repair work.
- 90% metal content provides consistent solder deposition and reliable solder joints.
- NC-559-V2 flux system provides excellent wetting with clear, low residue after soldering.
- Please check the warranty policy for details!
- Same Day Ground and Overnight Shipping.



