- LF-4300 Sn42/Bi58 T4 %87 16400
- Is a lead-free, water-washable solder paste with a REL0 flux classification, trusted by Tier I military and avionic OEMs. It offers excellent print definition at speeds up to 100 mm/sec, with low voiding performance even on LGA components. RoHS II and REACH compliant, LF-4300 is compatible with enclosed print heads and available in both print and dispense grades—making it ideal for high-reliability, precision electronic assembly.
- Amtech LF-4300 solder paste features a Sn42/Bi58 lead-free, bismuth-based alloy in a 35g syringe, ideal for BGA/SMD rework and PCB assembly applications.
- Specs: Sn42/Bi58 lead-free bismuth alloy, T3 powder 25–45µm particle size, 87% metal content, 35g syringe, LF-4300 formula part TBD.
- Suitable for rework and assembly jobs where a Sn/Bi alloy is preferred, offering precise syringe dispensing for confined areas and detailed repair work.
- Benefits
- Enables precise, consistent solder deposition for high-density PCB designs.
- Supports automated manufacturing with excellent printability and reflow characteristics.
- Enhances joint reliability for lead-free applications.
- Reduces defects like bridging, voiding, and tombstoning.
- Compatible with various application methods including stencil printing and dispensing.
- No Corrosion.
- Complies with REACH articles 33 and 67 of regulation (EC) No. 1907/2006. Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials.
- Please check the warranty policy for details!
- Same Day Ground and Overnight Shipping.

