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Amtech LF-4300 SAC305 T4 88.5% 40g jar (217)

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Amtech LF-4300 SAC305 T4 88.5% 40g jar (217)

SKU: AMTECH-217
New Bin Number: 4-W6-4A

$23.00

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Amtech LF-4300 SAC305 T4 88.5% 40g jar (217)

Amtech LF-4300 SAC305 T4 88.5% 40g jar (217)

Amtech LF-4300 SAC305 T4 88.5% 40g jar (217)

Amtech LF-4300 SAC305 T4 88.5% 40g jar (217)

Suitable for PCB, motherboard, BGA, SMD, IC, and other lead-free electronic soldering and rework applications requiring SAC305 solder paste.

SAC305 lead-free solder paste formulated with Sn96.5/Ag3.0/Cu0.5 alloy.
Melting range starts at approximately 217°C, making it suitable for standard lead-free soldering applications.
T4 fine-particle formulation provides precise solder deposition for small pads and components.
88.5% metal content is designed for consistent application and reliable lead-free solder joints.
LF-4300 provides excellent wetting and is designed for precision electronic assembly and rework applications.

Please check the warranty policy for details!
Warranty Policy Link
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