- LF-4300 16040
- Is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. AMTECH LF-4300-TF may be used for BGA sphere attachment and reballing. AMTECH LF-4300-TF is also designed to work on all flip chip bumping and chip scale packaging sites.
- Benefits
- Water washable tacky flux.
- REL0 flux classification.
- Optimized for lead-free and standard allow systems.
- Wide process window.
- Residue can be left on board in most assemblies. (not recommended for high impedance assemblies)
- Excellent wetting compatibility on most board finishes.
- Low voiding, including LGA.
- REACH compliant articles 33 and 67 of regulation (EC) No. 1907/2006. Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials.
- Please check the warranty policy for details!
- Same Day Ground and Overnight Shipping.

