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Amtech RMA-223-AS Sn63/Pb37 T4 87% 16400 Solder Paste (35g)
- SKU
- AMTECH-15140
- New Bin Number
- 4-Z7-2E
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$18.15
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- RMA-223-AS Sn63/Pb37 T4 %87
- Is a leaded, rosin mildly active solder paste formulated for excellent wetting and exceptional print definition. Classified under ROM1 flux, it delivers low voiding—including under LGA components—clear residue, minimal mid-chip beading, and a long stencil life. Compatible with enclosed print heads and available in both print and dispense grades, RMA-223-AS is REACH compliant and ideal for high-precision, reliable soldering applications.
- Amtech RMA-223-AS solder paste with Sn63/Pb37 leaded alloy comes in a 35g syringe, designed for BGA and SMD rework as well as PCB assembly applications.
- Specs: Sn63/Pb37 leaded formula, T3 powder 20–38µm particle size, 87% metal content, 35g syringe, Melting temperature 183°C (361°F), Item Part 15140.
- Suitable for BGA rework, stencil printing, PCB repair, and fine soldering tasks that require smooth flow and precise dispensing.
- Benefits
- Enables precise, consistent solder deposition for high-density PCB designs
- Supports automated manufacturing with excellent printability and reflow characteristics
- Enhances joint reliability for leaded applications
- Reduces defects like bridging, voiding, and tombstoning
- Compatible with various application methods including stencil printing and dispensing
- Complies with REACH articles 33 and 67 of regulation (EC) No. 1907/2006. Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials
- Please check the warranty policy for details!
- Same Day Ground and Overnight Shipping.
